| PART |
Description |
Maker |
| F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Photonics
|
| F4294-09 |
MCP ASSEMBLY WITH CENTER HOLE FOR REFLECTRON MS
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| AM49DL640BG25IS AM49DL640BG25IT AM49DL640BG35IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Spansion, Inc.
Spansion Inc.
Advanced Micro Devices
|
| S71WS-NX0 S71WS512ND0BFWA23 S71WS512NC0BFWA23 S71W |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
SPANSION LLC
|
| S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| 2-1418883-1 |
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
|
Tyco Electronics
|
| AM70PDL127BDH66IS AM70PDL127BDH66IT AM70PDL127BDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装（MCP / XIP）的快闪记忆体，数据存储的MirrorBit闪存和移动存储芯片（XIP）的
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位）的CMOS 3.0伏特，只有页面模式闪存数据存28兆位米16位）的CMOS
|
Spansion, Inc.
Spansion Inc.
|
| KA100O015E-BJTT |
MCP Specification
|
Samsung semiconductor
|
| MB84VD21181EM-70PBS MB84VD21183EM-70PBS MB84VD2118 |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS SPECIALTY MEMORY CIRCUIT, PBGA56
|
Spansion Inc.
Spansion, Inc.
|
| WF4M32-XH2X5 WF4M32-XG2TX5 WF4M32-XG4TX5 |
Flash MCP 闪存MCP
|
OKI SEMICONDUCTOR CO., LTD.
|
